SUGA, TADATOMO: search on Z-Library

The world's largest scientific articles store. 70,000,000+ articles for free.

Don't use scam websites

1

Wafer Bonding of SiC-AlN at Room Temperature for All-SiC Capacitive Pressure Sensor

Mu, Fengwen, Xu, Yang, Shin, Seongbin, Wang, Yinghui, Xu, Hengyu, Shang, Haiping, Sun, Yechao, Yue, Lei, Tsuyuki, Tatsurou, Suga, Tadatomo, Wang, Weibing, Chen, Dapeng

Journal:

Year:

2019

Language:

english

File:

PDF, 2.08 MB

english, 2019

2

A Comparative Study: Void Formation in Silicon Wafer Direct Bonding by Oxygen Plasma Activation with and without Fluorine

Wang, Chenxi, Liu, Yannan, Suga, Tadatomo

Journal:

ECS Journal of Solid State Science and Technology

Year:

2017

Language:

english

File:

PDF, 836 KB

english, 2017

3

Self-excited force-sensing microcantilevers with piezoelectric thin films for dynamic scanning force microscopy

Toshihiro Itoh, Tadatomo Suga

Journal:

Sensors and Actuators A: Physical

Year:

1996

Language:

english

File:

PDF, 287 KB

english, 1996

4

Low-temperature direct bonding of silicon and silicon dioxide by the surface activation method

Hideki Takagi, Ryutaro Maeda, Teak Ryong Chung, Tadatomo Suga

Journal:

Sensors and Actuators A: Physical

Year:

1998

Language:

english

File:

PDF, 833 KB

english, 1998

5

Self-excited piezoelectric PZT microcantilevers for dynamic SFM—with inherent sensing and actuating capabilities

Chengkuo Lee, Toshihiro Itoh, Tadatomo Suga

Journal:

Sensors and Actuators A: Physical

Year:

1999

Language:

english

File:

PDF, 1.45 MB

english, 1999

6

[IEEE 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2014.7.15-2014.7.16)] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Surface activated bonding method applied in MEMS pressure sensor with TSV structures

Wu, Zijian, Wang, Yinghui, Cai, Jian, Wang, Qian, Suga, Tadatomo

Year:

2014

Language:

english

File:

PDF, 405 KB

english, 2014

7

[IEEE 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2014.7.15-2014.7.16)] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - SiC wafer bonding by modified suface activated bonding method

Mu, Fengwen, Suga, Tadatomo, Fujino, Masahisa, Takahashi, Yoshikazu, Nakazawa, Haruo, Iguchi, Kenichi

Year:

2014

Language:

english

File:

PDF, 747 KB

english, 2014

8

Effect of Formic Acid Vapor In Situ Treatment Process on Cu Low-Temperature Bonding

Yang, Wenhua, Akaike, Masatake, Suga, Tadatomo

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 3.27 MB

english, 2014

9

[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - Direct bonding of polymer to glass wafers using surface activated bonding (SAB) method at room temperature

Suga, Tadatomo, Matsumae, Takashi, Matsumoto, Yoshiie, Nakano, Masashi

Year:

2012

Language:

english

File:

PDF, 637 KB

english, 2012

10

Combined surface activated bonding using H-containing HCOOH vapor treatment for Cu/Adhesive hybrid bonding at below 200 °C

He, Ran, Fujino, Masahisa, Akaike, Masatake, Sakai, Taiji, Sakuyama, Seiki, Suga, Tadatomo

Journal:

Applied Surface Science

Year:

2017

Language:

english

File:

PDF, 1.03 MB

english, 2017

11

[IEEE 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2017.5.16-2017.5.18)] 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Room temperature SiC-SiC direct wafer bonding by SAB methods

Mu, Fengwen, Iguchi, Kenichi, Nakazawa, Haruo, Takahashi, Yoshikazu, Fujino, Masahisa, Suga, Tadatomo

Year:

2017

Language:

english

File:

PDF, 223 KB

english, 2017

12

[IEEE 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Kanazawa, Japan (2019.5.21-2019.5.25)] 2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Room-Temperature Wafer Bonding with Titanium Thin Films Based on Formation of Ti/Si Amorphous Layers

Higurashi, Eiji, Azuma, Hayato, Yamamoto, Michitaka, Matsumae, Takeshi, Kurashima, Yuichi, Takagi, Hideki, Suga, Tadatomo

Year:

2019

Language:

english

File:

PDF, 443 KB

english, 2019

13

Bumpless interconnect of ultrafine Cu electrodes by surface activated bonding (SAB) method

Akitsu Shigetou, Toshihiro Itoh, Tadatomo Suga

Journal:

Electronics and Communications in Japan (Part II: Electronics))

Year:

2006

Language:

english

File:

PDF, 2.99 MB

english, 2006

14

Broadband MEMS shunt switches using PZT/HfO2 multi-layered high k dielectrics for high switching isolation

Jiunnjye Tsaur, Kazumasa Onodera, Takeshi Kobayashi, Zhang-Jie Wang, Sven Heisig, Ryutaro Maeda, Tadatomo Suga

Journal:

Sensors and Actuators A: Physical

Year:

2005

Language:

english

File:

PDF, 526 KB

english, 2005

15

Electroplated Ni microcantilever probe with electrostatic actuation

Toshihiro Itoh, Shingo Kawamura, Kenichi Kataoka, Tadatomo Suga

Journal:

Sensors and Actuators A: Physical

Year:

2005

Language:

english

File:

PDF, 444 KB

english, 2005

16

Room temperature wafer level glass/glass bonding

M.M.R. Howlader, Satoru Suehara, Tadatomo Suga

Journal:

Sensors and Actuators A: Physical

Year:

2006

Language:

english

File:

PDF, 330 KB

english, 2006

17

The influence of surface profiles on leakage in room temperature seal-bonding

Hironao Okada, Toshihiro Itoh, Tadatomo Suga

Journal:

Sensors and Actuators A: Physical

Year:

2008

Language:

english

File:

PDF, 885 KB

english, 2008

18

Reliability of Au bump––Cu direct interconnections fabricated by means of surface activated bonding method

Qian Wang, Naoe Hosoda, Toshihiro Itoh, Tadatomo Suga

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 488 KB

english, 2003

19

Sol–gel derived PNNZT thin films for micromachined piezoelectric force sensors

Chengkuo Lee, Toshihiro Itoh, Tadatomo Suga

Journal:

Thin Solid Films

Year:

1997

Language:

english

File:

PDF, 360 KB

english, 1997

20

Morphology and microstructure of the Ar+-ion sputtered (0001) α-Al2O3 surface

Takeshi Akatsu, Christina Scheu, Thomas Wagner, Thomas Gemming, Naoe Hosoda, Tadatomo Suga, Manfred Rühle

Journal:

Applied Surface Science

Year:

2000

Language:

english

File:

PDF, 1.07 MB

english, 2000

21

Characteristics of low force contact process for MEMS probe cards

Toshihiro Itoh, Kenichi Kataoka, Tadatomo Suga

Journal:

Sensors and Actuators A: Physical

Year:

2002

Language:

english

File:

PDF, 413 KB

english, 2002

22

Electroplating Ni micro-cantilevers for low contact-force IC probing

Kenichi Kataoka, Shingo Kawamura, Toshihiro Itoh, Kaoru Ishikawa, Hideo Honma, Tadatomo Suga

Journal:

Sensors and Actuators A: Physical

Year:

2003

Language:

english

File:

PDF, 352 KB

english, 2003

23

Wafer-scale spontaneous bonding of silicon wafers by argon-beam surface activation at room temperature

Hideki Takagi, Ryutaro Maeda, Tadatomo Suga

Journal:

Sensors and Actuators A: Physical

Year:

2003

Language:

english

File:

PDF, 228 KB

english, 2003

24

Wafer level sealing characterization method using Si micro cantilevers

Hironao Okada, Toshihiro Itoh, Tadatomo Suga

Journal:

Sensors and Actuators A: Physical

Year:

2008

Language:

english

File:

PDF, 691 KB

english, 2008

25

Low-cycle fatigue properties of eutectic solders at high temperatures

YOSHIHARU KARIYA, TADATOMO SUGA

Journal:

Fatigue & Fracture of Engineering Materials & Structures

Year:

2007

Language:

english

File:

PDF, 437 KB

english, 2007

26

Nanoadhesion layer for enhanced Si–Si and Si–SiN wafer bonding

Ryuichi Kondou, Chenxi Wang, Akitsu Shigetou, Tadatomo Suga

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.15 MB

english, 2012

27

Investigation of fluorine containing plasma activation for room-temperature bonding of Si-based materials

Chenxi Wang, Tadatomo Suga

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 706 KB

english, 2012

28

Guest Editorial – Low Temperature Processing for Microelectronics and Microsystems Packaging

Tadatomo Suga, Jenn-Ming Song, Yi-Shao Lai

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 111 KB

english, 2012

29

Investigation of anti-stiction coating for ohmic contact MEMS switches with thiophenol and 2-naphthalenethiol self-assembled monolayer

Takahiro Yamashita, Toshihiro Itoh, Tadatomo Suga

Journal:

Sensors and Actuators A: Physical

Year:

2011

Language:

english

File:

PDF, 953 KB

english, 2011

30

[IEEE 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2014.7.15-2014.7.16)] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Fabrication of miniaturized polarization sensors using flip-chip bonding with atmospheric-pressure plasma activation

Ikeda, So, Yamamoto, Michitaka, Higurashi, Eiji, Suga, Tadatomo, Oguchi, Toshiaki

Year:

2014

Language:

english

File:

PDF, 228 KB

english, 2014

31

[IEEE 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2014.7.15-2014.7.16)] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Room-temperature wafer bonding with smooth Au thin film in ambient air using Ar RF plasma activation

Okumura, Ken, Higurashi, Eiji, Suga, Tadatomo, Hagiwara, Kei

Year:

2014

Language:

english

File:

PDF, 403 KB

english, 2014

32

[IEEE 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2014.7.15-2014.7.16)] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Carbon nanotube bump interconnect for flexible multilayer substrates

Fujino, Masahisa, Terasaka, Hidenori, Suga, Tadatomo

Year:

2014

Language:

english

File:

PDF, 309 KB

english, 2014

33

[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - Low temperature bonding for 3D integration — A review of the surface activated bonding (SAB)

Year:

2012

Language:

english

File:

PDF, 1.01 MB

english, 2012

34

[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - Water vapor containing plasma activation for room-temperature bonding

Wang, Chenxi, Umeda, Jun, Xu, Yan, Mawatari, Kazuma, Kitamori, Takehiko, Suga, Tadatomo

Year:

2012

Language:

english

File:

PDF, 593 KB

english, 2012

35

[IEEE 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2012.05.22-2012.05.23)] 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration - Low temperature Cu/Cu direct bonding using formic gas in-situ treatment

Yang, Wenhua, Akaike, Masatake, Suga, Tadatomo

Year:

2012

Language:

english

File:

PDF, 986 KB

english, 2012

36

[IEEE 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2014.7.15-2014.7.16)] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Low temperature bonding for 3D

Year:

2014

Language:

english

File:

PDF, 253 KB

english, 2014

37

[IEEE 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2014.7.15-2014.7.16)] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Cu/dielectric hybrid bonding using surface-activated bonding (SAB) technologies for 3D integration

Ran He,, Yamauchi, Akira, Suga, Tadatomo

Year:

2014

Language:

english

File:

PDF, 252 KB

english, 2014

38

[IEEE 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2014.7.15-2014.7.16)] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Directly bonded Ge/GaAs by surface activated bonding for high efficiency III–V multi-junction solar cells

Kono, Genki, Fujino, Masahisa, Yamashita, Daiji, Watanabe, Kentaroh, Sugiyama, Masakazu, Nakano, Yoshiaki, Suga, Tadatomo

Year:

2014

Language:

english

File:

PDF, 267 KB

english, 2014

39

[IEEE 2011 IEEE 11th International Conference on Nanotechnology (IEEE-NANO) - Portland, OR, USA (2011.08.15-2011.08.18)] 2011 11th IEEE International Conference on Nanotechnology - Surface activated bonding as nano-packaging technology

Suga, Tadatomo, Fujino, Masahisa, Kondoh, Ryuichi

Year:

2011

Language:

english

File:

PDF, 415 KB

english, 2011

40

[IEEE 2012 IEEE Photonics Conference (IPC) - Burlingame, CA, USA (2012.09.23-2012.09.27)] IEEE Photonics Conference 2012 - Status of bonding technology for hybrid integration - A review of the surface activated bonding (SAB)

Year:

2012

Language:

english

File:

PDF, 995 KB

english, 2012

41

Characteristics of fritting contacts utilized for micromachined wafer probe cards

Itoh, Toshihiro, Suga, Tadatomo, Engelmann, Gunter, Wolf, Jürgen, Ehrmann, Oswin, Reichl, Herbert

Journal:

Review of Scientific Instruments

Year:

2000

Language:

english

File:

PDF, 524 KB

english, 2000

42

[IEEE 2012 IEEE CPMT Symposium Japan (Formerly VLSI Packaging Workshop of Japan) - Kyoto, Japan (2012.12.10-2012.12.12)] 2012 2nd IEEE CPMT Symposium Japan - Low-temperature bonding of laser diode chips using atmospheric-pressure plasma activation of flat topped Au stud bumps with smooth surfaces

Yamamoto, Michitaka, Sato, Takeshi, Higurashi, Eiji, Suga, Tadatomo, Sawada, Renshi

Year:

2012

Language:

english

File:

PDF, 234 KB

english, 2012

43

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - A novel room-temperature wafer direct bonding method by fluorine containing plasma activation

Wang, Chenxi, Suga, Tadatomo

Year:

2010

Language:

english

File:

PDF, 1.43 MB

english, 2010

44

[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Low-temperature wafer bonding using gold layers

Wang, Ying-Hui, Lu, Jian, Suga, Tadatomo

Year:

2009

Language:

english

File:

PDF, 2.29 MB

english, 2009

45

Room-Temperature Direct Bonding Using Fluorine Containing Plasma Activation

Wang, Chenxi, Suga, Tadatomo

Journal:

Journal of The Electrochemical Society

Year:

2011

Language:

english

File:

PDF, 1.93 MB

english, 2011

46

Comparative annealing effect on bonded wafers in air and ultrahigh vacuum for microelectromechanical systems/microfluidics packaging

Journal:

Journal of Micro/Nanolithography MEMS and MOEMS

Year:

2010

Language:

english

File:

PDF, 1.65 MB

english, 2010

47

Nanobonding: A key technology for emerging applications in health and environmental sciences

Howlader, Matiar M. R., Deen, M. Jamal, Suga, Tadatomo

Journal:

Japanese Journal of Applied Physics

Year:

2015

Language:

english

File:

PDF, 3.89 MB

english, 2015

48

[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Low-temperature GaAs/SiC wafer bonding with Au thin film for high-power semiconductor lasers

Okumura, Ken, Higurashi, Eiji, Suga, Tadatomo, Hagiwara, Kei

Year:

2014

Language:

english

File:

PDF, 348 KB

english, 2014

49

[ASME ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference - San Francisco, California, USA (July 17–22, 2005)] Advances in Electronic Packaging, Parts A, B, and C - Low Cycle Fatigue Properties of Solder Alloys Evaluated by Micro Bulk Specimen

Kariya, Yoshiharu, Niimi, Tomokazu, Suga, Tadatomo, Otsuka, Masahisa

Year:

2005

Language:

english

File:

PDF, 701 KB

english, 2005

50

[IEEE 2016 International Conference on Electronics Packaging (ICEP) - Hokkaido, Japan (2016.4.20-2016.4.22)] 2016 International Conference on Electronics Packaging (ICEP) - Room-temperature wafer bonding using smooth gold thin films for wafer-level MEMS packaging

Kunimune, Yutaka, Okumura, Ken, Higurashi, Eiji, Suga, Tadatomo, Hagiwara, Kei

Year:

2016

Language:

english

File:

PDF, 553 KB

english, 2016

To build up a library is to create a life. It’s never just a random collection of books.

— Carlos María Domínguez

Official channel

Z-Library Desktop Launcher

Z-Library Since 2009 support@z-lib.do

EnglishРусскийEspañolItalianoελληνικάاللغة العربيةBahasa IndonesiaBahasa Malaysiaहिन्दीDeutschFrançaisPortuguêsУкраїнськаPolski中文繁體中文日本語Tiếng ViệtAzərbaycan DiliՀայոց լեզուภาษาไทยTürk Diliქართველიবাংলাپښتوతెలుగుاردو한국어SrpskiБългарски